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  caution : o bserve precautions when handling because these devices are sensitive to electrostatic discharge bipolar analog integrated circuit ? pc82 30 t u s ige :c low noise amplifier for gps document no. pu1 0 612 ej 0 1v0ds (1st edition) date published april 200 6 ns cp( n ) description the ? pc 82 30 t u is a silicon germanium carbon (sige :c ) monolithic integrated circuit designed as low noise amplifier for gps . this device exhibits low noise figure and high power gain characteristics, so this ic can improve the sensitivity of gp s receiver . in addition , the ? pc 8230tu which is included output matching circuit contributes to reduce external components and system size . th e package is 8 - pin lead - less minimold suitable for surface mount . this ic is manufactured using our uhs 4 ( u ltra h igh s peed process) sige :c bip olar process. features ? low noise : nf = 0 . 85 db typ. @ f in = 1 575 mhz ? high gain : g p = 18 . 5 db typ. @ f in = 1 575 mhz ? low current consumption : i cc = 6 . 0 m a typ . @ v cc = 3.0 v ? built - in power - sav ing function ? high - density surface mounting : 8 - pin lead - less minimold package (2.0 ? 2. 0 ? 0.5 mm) ? included output matching circuit ? included very robust bandgap regulator (small v cc and t a dependence) ? included protection circuits for esd applica t ion ? low noise amplifier for gps ordering informa tion part number order number package marking supplying form ? p c 82 30 tu - e2 ? p c 82 30 tu - e2 - a 8 - pin l ead - l ess m inimold (pb - free) 82 30 ? 8 mm wide embossed taping ? pin 5, 6, 7, 8 indicates pull - out direction of tape ? qty 5 kpcs/reel remark to order evalua tion samples, contact your nearby sales office. part number for sample order: ? pc8 2 30 t u - a
data sheet pu10 612 ej 0 1v0ds 2 ? pc82 30 t u pin connections and internal block diagram pin no. pin name 1 v cc 2 n.c. 3 gnd 4 input 5 power save 6 gnd 7 output 8 v cc absolute maximu m ratings parameter symbol test conditions ratings unit supply v oltage v cc t a = +25 ? c 4 . 0 v power - saving voltage v ps t a = +25 ? c 4.0 v power d issipation p d t a = +85c note 295 m w operating a mbient t emperature t a ? 4 0 to +85 ? c storage t emperature t stg ? 55 to +150 ? c input p ower p in +10 dbm note mounted on double - side copper - clad 50 ? 50 ? 1.6 mm epoxy glass pwb recommended operating range parameter symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v operating ambient temperature t a ? 40 +25 +85 ? c power save turn - on voltage v pson 2.2 ? v cc v power save turn - off voltage v pso ff 0 ? 0.8 v
data sheet pu10 612 ej 0 1v0ds 3 ? pc82 30 t u electrical characteristics ( t a = +25 ? cc = v ps = 3.0 v, f in = 1 575 mhz , unless otherwise specified ) par ameter symbol test conditions min. typ. max. unit circuit current i cc no signal (v ps = 3.0 v) 4.5 6 .0 8 .0 ma at power - saving mode (v ps = 0 v) ? ? 1 ? a power gain g p p in = ? 35 dbm 16 18 . 5 21 db noise figure nf ? 0.85 1. 1 5 db ? in put 3 rd order d istortion intercept point i ip 3 f in 1 = 1 574 mhz, f in 2 = 1 575 mhz ? ? 5 ? dbm input return loss rl in 8 11 ? db output return loss rl out 7 1 0 ? db isolation isl ? 39 ? db gain 1 db compression in put power p in (1 db) ? ? 17 ? dbm test circuit
data sheet pu10 612 ej 0 1v0ds 4 ? pc82 30 t u typical characteristics (t a = +25 ? remark the graphs indicate nominal characteristics.
data sheet pu10 612 ej 0 1v0ds 5 ? pc82 30 t u remark the graphs indicate nominal characteristics.
data sheet pu10 612 ej 0 1v0ds 6 ? pc82 30 t u s - parameter s ( t a = +25 ? cc = v ps = 3 .0 v , monitored at connector on board ) remark the graphs indicate nominal characteristics.
data sheet pu10 612 ej 0 1v0ds 7 ? pc82 30 t u package dimensions 8 - pin lead - less minimold (unit: mm) remark ( ) : reference value
8 data sheet pu10612ej01v0ds ? pc82 30 t u notes on correct use (1) observe precautions for handling because of electro - static sensitive devices. (2) form a ground pattern as wide ly as possible to minimize ground impedance (to prevent undesired oscillation). all the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be attached t o v cc line . (4) do not supply dc voltage to input pin. recommended soldering conditions this product should be soldered and mounted under t he following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temp erature) : 260 ? c or below time at peak temperature : 10 seconds or less time at temperature of 220 ? c or higher : 60 seconds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of ro sin flux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 ? c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 ? c or below maximum number of flow processes : 1 time maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature ( terminal temperature) : 350 ? c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).


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